TY - JOUR
N2 - The aim of the present work is to verify a numerical implementation of a binary fluid, heat conduction
dominated solidification model with a novel semi-analytical solution to the heat diffusion equation.
The semi-analytical solution put forward by Chakaraborty and Dutta (2002) is extended by taking into
account variable in the mushy region solid/liquid mixture heat conduction coefficient. Subsequently,
the range in which the extended semi-analytical solution can be used to verify numerical solutions is
investigated and determined. It has been found that linearization introduced to analytically integrate
the heat diffusion equation impairs its ability to predict solidus and liquidus line positions whenever
the magnitude of latent heat of fusion exceeds a certain value.
JO - Chemical and Process Engineering
L1 - http://so.czasopisma.pan.pl/Content/103640/PDF/CPE-39-1-art_07_119101_7.pdf
L2 - http://so.czasopisma.pan.pl/Content/103640
PY - 2018
IS - No 1
KW - heat diffusion
KW - semi-analytical solution
KW - numerical methods
KW - binary fluid solidification
A1 - Wacławczyk, Tomasz
A1 - Schäfer, Michael
PB - Polish Academy of Sciences Committee of Chemical and Process Engineering
VL - vol. 39
JF - Chemical and Process Engineering
T1 - VERIFICATION OF A BINARY FLUID SOLIDIFICATION MODEL USING SEMI-ANALITYCAL SOLUTION OF 1D HEAT DIFFUSION EQUATION
DA - 2018.03.30
UR - http://so.czasopisma.pan.pl/dlibra/docmetadata?id=103640
DOI - 10.24425/119101
ER -